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Vecomulti: the electroformed
multi level stencil
Vecomulti
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makes it possible to vary the quantity of printed paste by
varying the thickness of the stencil; |
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can considerably reduce waste levels thanks to paste variation
in the case of differing components; |
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can be supplied with a range of different thickness'
on either the squeegee side or the PCB side |
The electroforming process has several inherent advantages over other
techniques for producing stencils. A major advantage of electroforming
is the ability to produce smooth, tapered slot walls. By making the
slot width on the printed circuit board side of the stencil mask slightly
larger than on the squeegee side, the paste is not disturbed when
the stencil is removed. The much smoother side walls also allow for
easy release of the solder paste.
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