STORK VECO

Vecoplus wafer: the electroformed stencil for wafer bumping
The electroforming process has several inherent advantages over other techniques for producing stencils. A major advantage of electroforming is the ability to produce smooth, tapered slot walls. By making the slot width on the printed circuit board side of the stencil mask slightly larger than on the squeegee side, the paste is not disturbed when the stencil is removed. The much smoother side walls also allow for easy release of the solder paste.								Vecoplus Wafer
Durability The Nickel Vecoplus wafer stencils are much harder than competitive Products making it possible to use them from 3 to 5 times longer. The increased hardness likewise reduces the risk of damage during handling. Even the use of a metal squeegee will not wear the stencil. The extended life cycle of the stencil results in increased printing process yields and reduced costs for the user. < back > next								Vecoplus Wafer