Technologies  •  Electroforming  •  Etching   -materials   -products   -specifications  •  Laser Cutting Products Markets

Photo-etching specifications Below are the general details concerning the etching process. If you need more than listed below, please contact us, so we can discuss the possibilities of your preferred products.The etching technology has several advantages over punching, electroforming , laser-cutting and wire-erosion technology. Photo-etching specifications       Material  thickness(t)  0.050 - 1.0 mm Tolerances depends on material thickness, limit ± 0.010 mm t: 0.050 - 0.100 mm = ± 0.3t/0.2t t: 0.100 - 0.200 mm = ± 0.2t/0.15t t: > 0.200 mm = ± 0.1t Minimum hole/slot t: 0.025 - 0.050 mm = 1.6t t: 0.050 - 0.100 mm = 1.0/1.3t t: > 0.100 mm = 0.8t Minimum bar-width t: 0.050 - 0.200 mm = 1.0t t: > 0.200 mm = 1.0t   Pitch tolerances ± 0.0025 - 0.010 mm x distance Etchprofile (a) t: 0.015 - 0,050 mm a » 0.2t t: 0.050 - 0.100 mm a » 0.2/0.1t t: 0.100 a » 0.1t Corner radii r = 0.5 - 0.1t Post treatments < back matt black, Au, Ru, Pt, lead-tin plated etc.